HSB27-434316
CUI Devices
HSB27-434316
CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
Reference Price (USD)
1+
$2.60000
500+
$2.574
1000+
$2.548
1500+
$2.522
2000+
$2.496
2500+
$2.47
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB27-434316
2,60 USD
Product details
Product Attributes
- starea produsului: Active
- tip: Top Mount
- pachet racit: BGA
- metoda de atasare: Adhesive
- formă: Square, Pin Fins
- lungime: 1.697" (43.10mm)
- lăţime: 1.697" (43.10mm)
- diametru: -
- înălțimea aripioarelor: 0.650" (16.51mm)
- putere disipată @ creșterea temperaturii: 8.98W @ 75°C
- rezistență termică @ flux de aer forțat: 2.80°C/W @ 200 LFM
- rezistenta termica @ naturala: 8.35°C/W
- material: Aluminum Alloy
- finisaj material: Black Anodized
You May Also Be Interested In
